Automated visual inspection of IC packages
U Maung Maung Thet
Date of Issue2002
School of Electrical and Electronic Engineering
This dissertation focuses on some issues on the automatic inspection of IC packages and presents computer vision based techniques that were developed to perform automatic IC print mark inspection, automatic IC leads inspections, and inspection of the batch numbers on IC packages using the OCR system.
DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Nanyang Technological University