Characterization of lead free solder joints in microelectronics assemblies
Hla Phone Maw.
Date of Issue2006
School of Mechanical and Aerospace Engineering
Wafer level packaging using organic substrate is being used for traditional electronic packages in demanding miniaturization of products. The organic substrates may not be the best choice for very high frequency application demanding low loss requirement for few niche applications in communication and defense industries.
DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics