A structured approach for routing of high density PCB.
Date of Issue2005
School of Electrical and Electronic Engineering
The aim of this project is to design a Structured Methodology for Routing of High Density Printed Circuit Board (PCB). PCB may include the through hole components and Surface Mounted Technology (SMT) components. The routing methodology is based on the Modularized Routing Methodology. This methodology can guarantee 100% completion of auto routing and pre-determine the number of layer required.
DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits
Nanyang Technological University