New techniques for localization of shorted and open interconnect failures in ICs by using laser beam technology.
Thaw Zin Myint.
Date of Issue2004
School of Electrical and Electronic Engineering
Open-circuit and short-circuit defects in electrical conductors within integrated circuits (ICs) can result in major IC yield and reliability problems. A capability for localizing and identifying these types of defects is important for analyzing ICs to determine failure mechanisms therein, for qualifying ICs as known-good devices, and for implementing corrective action during IC fabrication to minimize the occurrence of such defects.
DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Nanyang Technological University