Characterization of copper chemical mechanical polishing induced defects.
Teo, Tai Yong.
Date of Issue2004
School of Electrical and Electronic Engineering
Our results show that defects such as scratches and organic residues were produced by our Cu CMP process. Scratches can be attributed to the abrasive particles incorporated in the polishing slurry.
DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
Nanyang Technological University