Effect of surface treatments on Cu/Ultra-low k interconnection technology.
Tan, Hwa Jin.
Date of Issue2004
School of Electrical and Electronic Engineering
Single damascene copper interconnect structures were fabricated. Cu/ultra-low-k (porous SiLKTM) interconnects were subjected to surface treatments to study the effects on the structural and electrical properties, including Fourier transform infrared spectroscopy, atomic force microscopy and electrical testing.
DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
Nanyang Technological University