Electromigration reliability of copper interconnect in submicron microelectronics application
Ang, Kian Ann
Date of Issue2005
School of Electrical and Electronic Engineering
In this dissertation, the effects of temperature and interconnect properties on copper metallization electromigration are discussed. Accelerated Life Testing is used to obtain performance data on devices at a quicker rate.
DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Nanyang Technological University