Source line resistance failure issues and process optimisation of self aligned source etch.
Su, Julia Hui Fong.
Date of Issue2004
School of Electrical and Electronic Engineering
A self-aligned source oxide etch recipe using low power recipe was changed to higher power recipe to improve production cycle time (due to higher etch rate) and resolve plasma un-ignition. However, some lots started to fail with higher source line resistance during electrical testing.
DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Nanyang Technological University