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      A study of effect of ICPA on RF CBGA packages

      Thumbnail
      EEE-THESES_1047.pdf (11.47Mb)
      Author
      Qiu, Xue Dong.
      Date of Issue
      2004
      School
      School of Electrical and Electronic Engineering
      Abstract
      Most radio frequency integrated circuit (RFIC) designers concentrate their characterization effort on the die. Often the package design is being overlooked. Due to the growing concerns in high frequency design, consideration of parasitic effects for the bonding wires is essential in integrated circuit (IC) packaging of radio frequency (RF) and deep submicron high speed very large scale integrated (VLSI) circuits.
      Subject
      DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
      Type
      Thesis
      Rights
      Nanyang Technological University
      Collections
      • EEE Theses

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