Design of on-package RF dual-band filter
Anak Agung Alit Apriyana
Date of Issue2004
School of Computer Engineering
In this project, a dual-band BPF for the concurrent dual-band wireless transceiver was developed. The dual-band BPF was implemented using ceramic material to obtain a low insertion loss performance. In order to minimize the device area, the dual-band BPF was place on the top of the IC package. In this case, the filter was implemented using a transmission line rather than a lumped element to minimize losses.
DRNTU::Engineering::Electrical and electronic engineering::Wireless communication systems
Nanyang Technological University