dc.contributor.authorSia, Choon Beng.
dc.date.accessioned2009-12-22T06:20:02Z
dc.date.available2009-12-22T06:20:02Z
dc.date.copyright2008en_US
dc.date.issued2008
dc.identifier.citationSia, C. B. (2008). Device design, characterization and modeling of inductors and interconnects for RFIC applications. Doctoral thesis, Nanyang Technological University, Singapore.
dc.identifier.urihttp://hdl.handle.net/10356/20669
dc.description.abstractEscalating demands for personal wireless communication equipment have spearheaded development of affordable RF System-on-Chip (SoC) solutions. Silicon is believed to be the most suitable material that can satisfy the demands of this rapidly growing wireless market. Advancements in technology have continued to enhance the cutoff frequencies of active devices such as MOSFETs and SiGe HBTs. Nonetheless, low resistive bulk silicon and high resistive metallization have made on-chip inductors and interconnects major obstacles to achieving exemplary circuit characteristics at giga-hertz frequencies.en_US
dc.format.extent226 p.en_US
dc.language.isoenen_US
dc.subjectDRNTU::Engineering::Electrical and electronic engineeringen_US
dc.titleDevice design, characterization and modeling of inductors and interconnects for RFIC applicationsen_US
dc.typeThesis
dc.contributor.supervisorYeo Kiat Sengen_US
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.description.degreeDoctor of Philosophy (EEE)en_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record