Cost modeling of multichip modules substrates technology in concurrent engineering.
Mok, Mun Fai.
Date of Issue1997
School of Mechanical and Aerospace Engineering
Choosing and developing advance electronic packaging technology to meet product needs often carry ill-affordable alternatives late into the decision process. During the concept exploration and defmition (CE & D) phase of products and its manufacturing processes, designers must be able to assess both the performance and cost impacts of their choices. Early decisions made during the CE & D phase will drive the cost of future programs/products more than any other phase of development.
NANYANG TECHNOLOGICAL UNIVERSITY