Machine-vision guided underfill dispense system for direct chip attach electronics packages
Wong, Jordan How Tho.
Date of Issue1998
School of Mechanical and Aerospace Engineering
The Jetski production was initiated to make pagers that contained high valued-added components. The processes of assembling the components into the pagers adopted the Direct Chip Attach or Flip Chip technique. One of the processes, known as underfill operation, was designed by the author.
NANYANG TECHNOLOGICAL UNIVERSITY