Processing and characterization of electrically conductive adhesives
Yong, Sim Seah.
Date of Issue2004
School of Materials Science and Engineering
Electrically Conductive Adhesives (ECAs) are fast emerging as a promising solder alternative solutions. It is playing an increasingly important role in the design and production of electronic packages. Fewer processing steps and lower curing temperatures as compared to the solder technology are the main reasons driving their increasing implementation in microelectronics packaging.