dc.contributor.authorZee, Bernice Mei Lin
dc.date.accessioned2009-12-08T06:30:09Z
dc.date.available2009-12-08T06:30:09Z
dc.date.copyright2004en_US
dc.date.issued2004
dc.identifier.urihttp://hdl.handle.net/10356/19333
dc.description.abstractElectroless nickel (EN) plating is a viable interconnection material for flip chip applications due to its process simplicity and low cost. The selective nature of EN plating allows the possibility of a maskless, waferscale process for the fabrication of fine pitch interconnects and this makes it one of the most promising techniques for fine pitch applications.en_US
dc.format.extent124 p.en_US
dc.language.isoenen_US
dc.subjectDRNTU::Engineering::Materialsen_US
dc.titleFine pitch electroless nickel platingen_US
dc.typeThesis
dc.contributor.supervisorChen Zhong (MSE)en_US
dc.contributor.schoolSchool of Materials Science and Engineeringen_US
dc.description.degreeMASTER OF PHILOSOPHY (MSE)en_US


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