Fine pitch electroless nickel plating
Zee, Bernice Mei Lin
Date of Issue2004
School of Materials Science and Engineering
Electroless nickel (EN) plating is a viable interconnection material for flip chip applications due to its process simplicity and low cost. The selective nature of EN plating allows the possibility of a maskless, waferscale process for the fabrication of fine pitch interconnects and this makes it one of the most promising techniques for fine pitch applications.