Non-conductive adhesives for micro joining in semiconductor interconnect applications
Teh, Lay Kuan.
Date of Issue2003
School of Materials Science and Engineering
This work addresses the impact of NCA materials employed on the reliability performance of flip-chip package. Four commercially available non-conductive adhesives (NCAs), designed as NCA-A, NCA-B, NCA-C and NCA-D were investigated. The test vehicle used as a 4x4 mm, electroless Ni-Au bumped flip-chip assembled on FR4 epoxy printed circuit board (PCB) substrates with NCAs.