dc.contributor.authorWang, Ting.
dc.date.accessioned2009-10-26T00:52:30Z
dc.date.available2009-10-26T00:52:30Z
dc.date.copyright2008en_US
dc.date.issued2008
dc.identifier.urihttp://hdl.handle.net/10356/19163
dc.description.abstractThis report describes the project carried out during the author’s 22-week Industrial Attachment with Institute of Microelectronics, A*STAR, Singapore. The main objective of this project is to design a 2.5Gbps transceiver module for short-reach POF application. Three major areas have been discussed: the electrical transceiver module designs, the corresponding PCB designs, and the characterization of the transceiver. Two designs are involved: one is utilizing commercial IC chips for the circuitry design testing and another is utilizing the CMOS IC chips designed by IME internally. Only the former board is assembled and characterized. The results are interpreted and discussed in this project. They can show that the transceiver is able to perform well in the 2.5Gbps operation. However, future modifications are required for a more efficient transceiver design, especially for the IME CMOS POF transceiver design.en_US
dc.format.extent97 p.en_US
dc.language.isoenen_US
dc.rightsNanyang Technological University
dc.subjectDRNTU::Engineering::Electrical and electronic engineeringen_US
dc.titleReport on industrial attachment with Institute of Microelectronicsen_US
dc.typeIndustrial Attachment (IA)en_US
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.description.degreeELECTRICAL and ELECTRONIC ENGINEERINGen_US
dc.contributor.supervisor2Zhang Jingen_US


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