dc.contributor.authorSiow, Kim Shyong.en_US
dc.date.accessioned2008-10-20T08:26:47Z
dc.date.available2008-10-20T08:26:47Z
dc.date.copyright1999en_US
dc.date.issued1999en_US
dc.identifier.urihttp://hdl.handle.net/10356/13538
dc.description.abstractSurface mount technology has increasingly become the industry norm and slowly replaced the pin through hole technique. This preference has led to a demand for higher quality solder joints. Besides the traditional role as an electrical connection, the joint needs to be able to act as a load bearing element. The solder must be able to sustain the load during manufacture, transport and use. The most common solder used in the industry is the Sn - Pb family of alloys. In recent years, lead has been linked to many health problems and may be phased out in the future. Intensive studies are being conducted to find suitable replacements for lead-based solders and Sn-3.5Ag is one such solder.en_US
dc.format.extent106 p.en_US
dc.language.isoenen_US
dc.subjectDRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnectsen_US
dc.titleFracture properties of Sn-37Pb and Sn-3.5Ag solder jointsen_US
dc.typeThesisen_US
dc.contributor.supervisorManoharan, Mohanen_US
dc.contributor.schoolSchool of Materials Science and Engineeringen_US
dc.description.degreeDoctor of Philosophy (SME)en_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record