dc.contributor.authorCheng, Soon Kiong.en_US
dc.date.accessioned2008-09-01T01:44:56Zen_US
dc.date.accessioned2008-10-20T08:22:54Z
dc.date.available2008-09-01T01:44:56Zen_US
dc.date.available2008-10-20T08:22:54Z
dc.date.copyright1998en_US
dc.date.issued1998en_US
dc.identifier.urihttp://hdl.handle.net/10356/13529
dc.description.abstractThe project attempts to develop an impact reliability testing analysis methodology for adhesive bonded joints used commonly in structural and electronic packaging applications. This is especially applicable to portable mechanical and electronic products that are prone to dropping from height and yet expected to work reliably after dropping.en_US
dc.format.extent40 p.en_US
dc.language.isoenen_US
dc.subjectDRNTU::Engineering::Materials::Material testing and characterizationen_US
dc.titleImpact testing and analysis of adhesive bondsen_US
dc.typeThesisen_US
dc.contributor.supervisorPang, John Hock Lyeen_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.description.degreeAMSC(MECHANICS and PROCESSING OF MATERIALS)en_US


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