Impact testing and analysis of adhesive bonds.
Cheng, Soon Kiong.
Date of Issue1998
School of Mechanical and Aerospace Engineering
The project attempts to develop an impact reliability testing analysis methodology for adhesive bonded joints used commonly in structural and electronic packaging applications. This is especially applicable to portable mechanical and electronic products that are prone to dropping from height and yet expected to work reliably after dropping.
DRNTU::Engineering::Materials::Material testing and characterization