Investigation of the performance of a thermosyphon pin fin heat sink.
Date of Issue1999
School of Mechanical and Aerospace Engineering
An analytical, numerical and experimental investigation was conducted to examine the performance of the thermosyphon pin fin heat sink which consists of a flat plate with area of 40 x 40 mm2 and thickness of 10 mm as the evaporator and an array of 5 x 5 small water/copper tubes with inner diameter of 2.5 mm and length of 58 mm as the condenser.
DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials